• Reduces thermal resistance, as part of a complete cooling solution, allowing cooling efficiency gains up to 30% over heat pipes
  • Flat & ultra thin for space constrained environments (starting at 1.5mm)
  • Very large heat dissipating surface area for superior performance within an overall cooling solution (up to Width = 70mm and Height = 500mm)
  • Uniform heat spreading for minimizing hot spots from high heat flux devices
  • Design versatility
    • Ability to mount directly on heat source (eliminating a base plate)
    • Easily integrates with complementary cooling components (fins or fans)
    • Bendable (both horizontal and vertical)
  • No moving parts or pumps means zero noise or power consumption